SAFI-Tech, Inc. Company Profile

SAFI-Tech applies its breakthrough, patented technology platform to create liquid metal microcapsules of No-Heat SAC305, enabling low temperature processing of the SMT industry's standard high temperature soldering alloy for electronics assembly.  SAFI-Tech technology encapsulates molten SAC305 in a robust nanofilm that prevents the alloy from solidifying when cooled to temperatures far below its melting point.

SAFI-Tech's No-Heat SAC305 microcapsules can be precisely placed, selectively activated, and processed at temperatures as low as ambient, while still meeting high product operating temperature requirements.  When the nanofilm is ruptured or dissolved on demand, the liquid metal flows out, wets, and solidifies in seconds to form a fully-metallic interconnect, without the time and expense of a reflow process that requires heating up to 260°C.

Design and assembly engineers gain several advantages with SAFI-Tech's no-heat paradigm:  expand the choices for substrate and component materials; advance design innovation and miniaturization for thinner, lighter, flexible products; meet market desires for size, shape, and functionality; increase volume throughput making interconnects in seconds; improve manufacturing yields by eliminating thermal defects; reduce energy costs and CO₂ emissions with lower energy consumption.  
SAFI-Tech, Inc. produces RoHS-compliant no-heat liquid metal microcapsules for use in electronics assembly at ambient temperatures, inspiring new product designs that are unachievable with current materials and processes.  SAFI-Tech's patented technology separates the use of liquid metal from the heat needed to flow the metal, offering wide applicability in conventional and printed/ flexible electronics manufacturing.