Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards EP77M-FMed is EP77M-FMed is a silver filled system that provides excellent electrical conductivity, with a low volume resistivity.
Optically Clear Epoxy Passes ISO 10993-5 Certification for Cytotoxicity EP30-4Med is designed to resist EtO sterilization, and also to withstand most detergents, disinfectants, bleaches and liquid sterilants.
Non-Cytotoxic Epoxy Resists Sterilization by Autoclaving, Radiation and Chemicals EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications.
Medical Grade Epoxy Offers Thermal Conductivity and Electrical Insulation Master Bond EP42HT-4AOMed Black is a two part epoxy created for medical device manufacturing. It is biocompatible and non-cytotoxic, passing both USP Class VI and ISO 10993-5 certifications.
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity Master Bond EP40Med, a two part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength.
Highly Flexible UV Curable Adhesive Meets ISO 10993-5 Standard for Cytotoxicity Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance.
Silver Conductive Silicone Adhesive Meets NASA Low Outgassing Specifications Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive. It passes NASA low outgassing specifications.
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity Master Bond EP36FR is a specialized one part epoxy that meets Airbus specifications for toxic gas emissions
Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications Product: EP30DPBFMed
Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature Master Bond's new one component that is electrically conductive and withstands high temperatures
Tough Epoxy Polysulfide Adhesive Resists High Temperatures Product: EP21TPHT
Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications Master Bond EP30DPBFMed is an epoxy that can be utilized in applications ranging from bonding and sealing to encapsulating and casting
UV22DC80-1Med: Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.
Non-Premixed and Frozen, One Part Epoxy for Chip Coating Master Bond Supreme 3CCM-85 is a single component epoxy designed for glob top and chip coating applications
Optically Clear, Low Viscosity Epoxy System Features High Flexibility Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.
High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance
High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial
Epoxy Features Very Low Coefficient of Thermal Expansion Master Bond has developed a new epoxy
Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile Master Bond UV22DC80-10F is a single component, nanosilica filled compound
One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications
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Master Bond Inc.
http://www.masterbond.com E: [email protected] T: (201) 343-8983 F: (201) 343-2132
Address 154 Hobart St., Hackensack, NJ, 07601-3950, United States View map