News

Medical Grade Epoxy Offers Thermal Conductivity and Electrical Insulation
Master Bond EP42HT-4AOMed Black is a two part epoxy created for medical device manufacturing. It is biocompatible and non-cytotoxic, passing both USP Class VI and ISO 10993-5 certifications. 

Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity
Master Bond EP40Med, a two part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength.

Highly Flexible UV Curable Adhesive Meets ISO 10993-5 Standard for Cytotoxicity
Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance.

Silver Conductive Silicone Adhesive Meets NASA Low Outgassing Specifications
Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive. It passes NASA low outgassing specifications.

B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity
Master Bond EP36FR is a specialized one part epoxy that meets Airbus specifications for toxic gas emissions

Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications
Product: EP30DPBFMed

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature
Master Bond's new one component that is electrically conductive and withstands high temperatures

Tough Epoxy Polysulfide Adhesive Resists High Temperatures
Product: EP21TPHT

Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications
Master Bond EP30DPBFMed is an epoxy that can be utilized in applications ranging from bonding and sealing to encapsulating and casting

UV22DC80-1Med: Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.

Non-Premixed and Frozen, One Part Epoxy for Chip Coating
Master Bond Supreme 3CCM-85 is a single component epoxy designed for glob top and chip coating applications

Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.

High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial

Epoxy Features Very Low Coefficient of Thermal Expansion
Master Bond has developed a new epoxy

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound

One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications