News

B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity
Master Bond EP36FR is a specialized one part epoxy that meets Airbus specifications for toxic gas emissions

Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications
Product: EP30DPBFMed

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature
Master Bond's new one component that is electrically conductive and withstands high temperatures

Tough Epoxy Polysulfide Adhesive Resists High Temperatures
Product: EP21TPHT

Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications
Master Bond EP30DPBFMed is an epoxy that can be utilized in applications ranging from bonding and sealing to encapsulating and casting

UV22DC80-1Med: Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.

Non-Premixed and Frozen, One Part Epoxy for Chip Coating
Master Bond Supreme 3CCM-85 is a single component epoxy designed for glob top and chip coating applications

Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.

High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial

Epoxy Features Very Low Coefficient of Thermal Expansion
Master Bond has developed a new epoxy

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound

One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications

Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications
MasterSil 972TC-LO is capable of transferring heat while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubber and plastics. The system has...

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications
Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This extraordinary compound also meets USP Class VI specifications and passes ISO 10993-5 testing....

One Component, Neutral Curing Silicone Passes USP Class VI and ISO 10993-5 Tests
Specially formulated for medical device applications, Master Bond MasterSil 912Med is a room temperature vulcanizing silicone system for high performance bonding, sealing and coating.