The Role Of Fine Pitch Wire In Implantable Devices Brochure

Bond Pads
COINING's Kovar Single Clad Copper Bond Pads are used as an intermediate layer between circuit board and sensor device that enables the electrical connection between both. Applications include, next generation pacemakers and defibrillators. Our Bond Pads are equally manufactured through the cladding process, ...

Au Plated Puck and Au Wire
A component within an electronic guidance system for a catheter that allows a needle to be directed to the tumor location for optimum treatment efficiency. Our Pucks are available in miniature sizes: 0.020 inches diameter (500 microns) at a thickness of 0.003 (75 microns). COINING's Pucks are used in applicat...

Gold Bonding Wire
Gold Bonding Wire provides low noise distortion and microwave signal speeds, precision, and chemically stable products. Gold Bonding Wire can be used to meet the various manufacturing requirements of the most advanced electrical devices. Gold Bonding Wire has always been the main method in the interconnection...

Niobium Gold Disk Weldment
COINING's Niobium Gold Disk Weldments are made from Niobium and is welded with a Gold disk. The application is used for Cardiac Rhythm. Niobium is beneficial for biocompatibility and the gold disk enables weldability. This key product enhances the performance of implantable devices by allowing long lasting ch...